Joint collaboration on SiC modules brings the next step in module compactness and maximum power density
KYOCERA AVX Components (Salzburg) GmbH, a leading international supplier of advanced electronic components, today announced it has entered into partnership with Nexperia, the essential semiconductor expert, to jointly produce a new 650 V, 20 A silicon carbide (SiC) rectifier module for high frequency power applications ranging from 3 kW to 11 kW power stack designs, aimed at application like industrial power supplies, EV charging stations, and on-board chargers. This release will represent a further deepening of the existing, long-lasting partnership between the two companies.
Space-saving and weight reduction are the key requirements for manufacturers of the next generation power applications. The compact footprint of this new SiC rectifier module will help to maximize power density, thereby reducing the amount of required board space and lowering the overall system cost. Thermal performance is optimized using a combination of top-side cooling (TSC) and an integrated negative temperature coefficient (NTC) sensor which monitors the device temperature and provides real time feedback for device or system level prognosis and diagnosis. This rectifier module has a low inductance package to enable high frequency operation and it has been qualified to operate with a junction temperature of up to 175 °C.
“This collaboration between Nexperia and KYOCERA AVX combines cutting edge silicon carbide semiconductors with state-of-the-art module and will allow Nexperia to better serve the market demand for power electronic products which offer exceptionally high levels of power density,” according to Katrin Feurle, Senior Director of the Product Group SiC at Nexperia. “The release of this rectifier module will represent the first step in what is envisaged as a long-term SiC partnership between Nexperia and KYOCERA AVX”.
Thomas Rinschede, Deputy Vice President Sensing and Control Division at KYOCERA AVX Components Sensing and Control Division, comments: “We are delighted to further extend our successful partnership with Nexperia into the production of silicon carbide modules for power electronics applications. Nexperia’s manufacturing expertise combined with KYOCERA module know-how make a compelling offering for customers looking to achieve higher power densities using wide bandgap semiconductor technology.”